Cray is proud to announce the Cray CX1000 system – a dense, power efficient and supremely powerful rack-mounted supercomputer that allows you to leverage the latest Intel® Xeon® processors for: • Scale-out computing using dual-socket Intel Xeon 5600s (Cray CX1000-C) • Scale-through (GPU) computing leveraging NVIDIA Tesla® modules (Cray CX1000-G) • Scale-up computing with SMP nodes built on Intel’s QuickPath Interconnect (QPI) technology offering “fat memory” nodes (Cray CX1000-S) High(brid) Performance Computing - The Cray CX1000 redefines HPC by delivering hybrid capabilities through a choice of chassis, each delivering one of the most important architectures of the next decade. While hybrid architectures often compromise individual capabilities in the quest for multi-purpose flexibility, the Cray CX1000 system doesn’t. Each of the Cray CX1000’s technologies is best-of-class and can be mixed-and-matched in a single rack, creating a customized hybrid computing platform to meet a variety of scientific workloads.

High(brid) Performance Software The Cray CX1000 system supports both Windows® HPC Server 2008 and Linux®, and allows a dual-boot environment so jobs can be loaded, on demand, with the preferred operating system. Cray offers Red Hat or Centos Linux on the Cray CX1000 product, controlled through the Cray Cluster Manager (powered by Platform™). The Cray Cluster Manager is a powerful system providing a combination of cluster management, scheduling software (Platform LSF), MPI and dual boot capability (Platform Adaptive Software). Cray’s strong support for both Windows HPC Server as well as Linux means users can select from the widest possible range of industrystandard HPC solutions from ISVs and key tools vendors. The Cray CX1000 product therefore truly represents a system without compromise – allowing you to go where you need to in your hardware selection (scale up, scale out or scale through) as well as in your software selection (Windows, Linux or both). Cray CX1000 Water-cooled Door Cray addresses data center cooling issues with an innovative option – a water-cooled door. Affixed to the back of the Cray 42U x 19” cabinet, the water-cooled door removes heat right next to the source. This active cooling system reduces heat in the data center by extracting the heat at the rack level. By driving the hot air through the water-cooled door, the air effectively exits the rack at the same temperature it entered. In addition to saving on air-conditioning the water-cooled door features active water flow and fan rotation speed monitoring, adjusting air and water circulation to actual cabinet and room temperature, minimizing power consumption. The watercooled door offers a cost-efficient alternative to an air-conditioning installation or complements an existing system. Cray anticipates that for one- to three-chassis configurations the air-cooled option (supported by air conditioning) will be adequate. However, for three-chassis systems and up, the watercooled door represents a highly effective option that will reduce hot spots and greatly increase the efficiency of the data centers cooling system. • Eliminate hot aisles, reducing MTBF • 77% energy savings compared to air conditioning Cray High(brid) Performance Computing! Cray CX1000 systems feature: • Optimization and simplification of the compute node for HPC • Integration of several compute nodes and first-level interconnect • Flexible structure for communication and I/O networks for the closest fit with customer requirements Cray CX1000 systems leverage: • New-generation Intel Xeon 5600 series processors with Intel QPI technology • InfiniBand network connection through an integrated 36-port Quad Data Rate (QDR) switch • Flexible storage: local HDD , local SSD and/or diskless blades • NVIDIA Tesla GPU acceleration • Large memory, many processor “fat node” capability— Coming Soon! Cray CX1000 systems deliver: • Improved performance through enhanced compute node efficiency, reduced latency, higher communication and I/O throughput • Denser scaling with water-cooled door option • Reduced cost of ownership from fewer components, better integration, reduced installation time, improved upgradeability, power efficiency • Enhanced reliability from less cabling